Curatela di atti di convegno (conference proceedings), 2023, ENG, 10.1145/3579028
Arcaini P.; ter Beek M.H.; Perrouin G.; Reinhartz-Berger I.; Machado I.; Vergilio S.R.; Rabiser R.; Yue T.; Devroey X.; Pinto M.; Washizaki H.
NII, Tokyo, Japan; CNR-ISTI, Pisa, Italy; University of Namur, Belgium; University of Haifa, Israel; Federal University of Bahia, Brazil; Federal University of Paraná, Brazil; Johannes Kepler University Linz, Austria; Simula, Norway; University of Namur, Belgium; University of Málaga, Spain; Waseda University, Japan
Welcome to SPLC'23, the 27th ACM International Systems and Software Product Line Conference. Looking back to the previous SPLC issues, the conference has been established as a thriving ground for practitioners, researchers, and educators working in areas related to systems and software product lines. With the increasing size and complexity of software, efficiently supporting software processes becomes an extremely important task. SPLC'23 acted as a venue fostering knowledge exchange and learning about the state of the art in software product lines aswell as newpractices, trends, innovations, insights from industrial applications, and new challenges. SPLC'23 was held at Hitotsubashi Hall in Tokyo, Japan, from August 28 to September 1, 2023.
ISTI – Istituto di scienza e tecnologie dell'informazione "Alessandro Faedo"
ID: 485806
Year: 2023
Type: Curatela di atti di convegno (conference proceedings)
Creation: 2023-08-29 09:51:11.000
Last update: 2023-08-29 11:17:53.000
CNR authors
External IDs
CNR OAI-PMH: oai:it.cnr:prodotti:485806
DOI: 10.1145/3579028