Articolo in rivista, 2004, ENG, 10.1016/j.mseb.2004.07.029

Thin nickel silicide layer formation on Silicon On Insulator (SOI) materials

Alberti A; Cafra B; Bongiorno C; Mannino G; Privitera V; Kammler T; Feudel T.

CNR-IMM; AMD

In this work we study the phase transition of 14 and 7 nm thin Ni layers grown on standard silicon and silicon on insulator (SOI) wafers implanted with As. We investigate the thermal stability of the NiSi phase using spike thermal processes which are widely used to preserve shallow junction from dopant diffusion during electrical activation. Nickel reaction has been performed in nitrogen ambient in the temperature range from 450 to 1125 oC and has been characterised by electrical and structural analyses. In spite of the thin layers used, spike annealing processes extend the stability window up to 900 oC preserving the NiSi layer from structural degradation. Moreover, the use of SOI substrates has a favourable impact on the silicide structure that prevents agglomeration and hole formation.

Materials science & engineering. B, Solid-state materials for advanced technology 114 , pp. 42–45

Keywords

nickel silicide, silicon, insulator materials

CNR authors

Privitera Vittorio, Alberti Alessandra, Mannino Giovanni, Bongiorno Corrado

CNR institutes

IMM – Istituto per la microelettronica e microsistemi