Articolo in rivista, 2014, ENG, 10.1002/pssc.201300132
Badala, Paolo; Faro, Giuseppe; Marcellino, Cinzia; Pellegrino, Giovanna; Santangelo, Antonello; Alberti, Alessandra
STMicroelectronics
Nickel silicide is widely used to realize contact terminals of integrated circuits and is usually formed by ex-situ heating treatments. In-situ reactions during sputter depo- sition of a Ni layer onto a HF p-type [001] Si substrate have been investigated in this work, by means of trans- mission electron microscopy, X-ray diffraction and X-ray reflectivity analyses. A thin layer of polycrystalline sili- cide, with extremely flat interfaces and in fiber texture with the Si substrate, has been obtained by introducing a sputter etching step just before Ni deposition and prop- erly modulating its duration. The work has also been aimed to decouple the thermal impact of sputter etching from its effect on surface cleaning, disclosing its key role in the whole reaction process. Cross-sectional TEM analysis of a nickel silicide layer, formed by in-situ solid-state reaction, showing an ex- tremely flat interface with the Si substrate.
Physica status solidi. C, Current topics in solid state physics (Print) 11 (1), pp. 160–163
nickel silicide, fiber texture, solid-state reaction, X-ray diffraction
Alberti Alessandra, Pellegrino Giovanna
ID: 307941
Year: 2014
Type: Articolo in rivista
Creation: 2015-02-13 16:15:26.000
Last update: 2020-08-26 16:51:05.000
CNR authors
CNR institutes
External IDs
CNR OAI-PMH: oai:it.cnr:prodotti:307941
DOI: 10.1002/pssc.201300132
ISI Web of Science (WOS): 000334667200034