Articolo in rivista, 2014, ENG, 10.1002/pssc.201300132

Structural characterization of in-situ silicided contacts textured on p-type [001] silicon

Badala, Paolo; Faro, Giuseppe; Marcellino, Cinzia; Pellegrino, Giovanna; Santangelo, Antonello; Alberti, Alessandra

STMicroelectronics

Nickel silicide is widely used to realize contact terminals of integrated circuits and is usually formed by ex-situ heating treatments. In-situ reactions during sputter depo- sition of a Ni layer onto a HF p-type [001] Si substrate have been investigated in this work, by means of trans- mission electron microscopy, X-ray diffraction and X-ray reflectivity analyses. A thin layer of polycrystalline sili- cide, with extremely flat interfaces and in fiber texture with the Si substrate, has been obtained by introducing a sputter etching step just before Ni deposition and prop- erly modulating its duration. The work has also been aimed to decouple the thermal impact of sputter etching from its effect on surface cleaning, disclosing its key role in the whole reaction process. Cross-sectional TEM analysis of a nickel silicide layer, formed by in-situ solid-state reaction, showing an ex- tremely flat interface with the Si substrate.

Physica status solidi. C, Current topics in solid state physics (Print) 11 (1), pp. 160–163

Keywords

nickel silicide, fiber texture, solid-state reaction, X-ray diffraction

CNR authors

Alberti Alessandra, Pellegrino Giovanna

CNR institutes

IMM – Istituto per la microelettronica e microsistemi

ID: 307941

Year: 2014

Type: Articolo in rivista

Creation: 2015-02-13 16:15:26.000

Last update: 2020-08-26 16:51:05.000

External links

OAI-PMH: Dublin Core

OAI-PMH: Mods

OAI-PMH: RDF

DOI: 10.1002/pssc.201300132

External IDs

CNR OAI-PMH: oai:it.cnr:prodotti:307941

DOI: 10.1002/pssc.201300132

ISI Web of Science (WOS): 000334667200034