Articolo in rivista, 2018, ENG, 10.1007/s00542-017-3583-6

Wafer-level micropackaging in thin film technology for RF MEMS applications

Persano A.; Siciliano P.; Quaranta F.; Taurino A.; Lucibello A.; Marcelli R.; Capoccia G.; Proietti E.; Bagolini A.; Iannacci J.

IMM-CNR, Lecce, Italy; IMM-CNR Roma, Italy; FBK-CMM, Trento, Italy

In this work, a thin-film packaging was developed to be used for radio-frequency microelectromechanical system configurations. The fabricated packages are suspended membranes in the multilayer SixNy/aSi/SixNy on conductive coplanar waveguides (CPWs) of different length. Several geometric parameters of the membranes, which are the length, the curvature radius at the vertices of the rectangular base, the density and the diameter of holes on the capping surface, were also varied. The mechanical properties of the suspended membranes were investigated by mechanical simulations and surface profilometry measurements as a function of the geometric parameters. RF characterization was performed to evaluate the impact of the package on the CPW performance. Finally, network analysis was carried out, allowing to clarify the origin of the RF losses measured for the fabricated microdevices.

Microsystem technologies 24 , pp. 575–585

Keywords

wafer-level, micropackaging, RF MEMS

CNR authors

Quaranta Fabio, Taurino Antonietta, Proietti Emanuela, Persano Anna, Lucibello Andrea, Capoccia Giovanni, Siciliano Pietro Aleardo, Marcelli Romolo

CNR institutes

IMM – Istituto per la microelettronica e microsistemi